Exhibition time: June 11-13, 2024

Exhibition location: Nuremberg Exhibition Center, Germany

Organizer: Messe Frankfurt, Germany

Held period: once a year

Exhibition introduction:


The 2024 SMT Nuremberg Integrated Circuit Exhibition in Germany will be held at the Nuremberg Convention and Exhibition Center in Germany from June 11 to 13, 2024. The organizer of the exhibition is Messe Frankfurt, Germany. The exhibition is held once a year. SMT, the Nuremberg Integrated Circuit Exhibition in Germany, is one of the important electronic manufacturing technology exhibitions in Europe. The SMT exhibition showcases new electronic manufacturing technologies, equipment and products, including printed circuit boards, surface mount technology, electronic assembly, soldering technology, test and measurement equipment, etc. Exhibitors and visitors come from all over the world, and the exhibition provides a platform to exchange market information, expand business networks, and find new business opportunities. In addition to displaying new technologies and products, the SMT Exhibition will also host a number of industry conferences and seminars, covering all aspects of the electronics manufacturing industry, providing exhibitors and visitors with an opportunity to learn and communicate.


Range of exhibition:


1. System development and production preparation

IC Design for Circuit Development PCB Assembly/Hardware Design Layout Design Circuit Optimization Hybrid Circuit Design Functional Testing Electrical Simulation Services Thermal Simulation Services Thermal Mechanical Simulation Services Electrostatic Discharge Audit Automated Incoming Inspection Marking and Labeling Equipment Laser Engraving Barcoding Solutions RFID Solutions Components Loading component preparation equipment


2. Materials and parts

Logic Components Mixed Signal Components Power Components Passive Components Capacitors Coils Resistors Quartz Oscillators Fuses/Fuse Holders Resonator Switches and Relays Relay Switches Code Switches Other Switches Thin Film Circuits Thick Film Devices Thin Film Devices Hybrid Modules Interconnect Equipment Plug Sockets Connectors Contact Components coupler cable


3 Circuit carrier and processing equipment

Circuit Carriers and Substrate Materials Ceramic Circuit Carriers Ceramic Substrates and Circuits LTCC Tape Materials and Circuits Direct Bonding Copper Substrates FR4 Circuit Carriers Resin Laminates Single and Multilayer Substrates PCBs with Embedded Components Thick Copper PCBs Heat Sink PCBs Flexible Circuits carrier


4 Process and Manufacturing

Components, Module Manufacturing Equipment Printing Stencils and Screen Printing Stencils and Screen Printers Stencils and Screen Scrapers Screen and Stencil Printing Supplies Cleaning Screens and Solder Frames Self-Mounting Systems Thick Film Ink Solder Paste Adhesive Dispensing and Mixing Dispenser Points Glue Accessories Encapsulants Spherical Top Materials Potting Materials Bottom Fillers Conformal Coatings Conformal Coating Systems


5 Reliability and testing

Component Test Equipment Optical Inspection Stations Automated Optical Inspection (AOI) Solder Paste AOI Assembly AOI Manual Optical Inspection Magnifying Lamps Microscopes PCB Inspection Systems Surface